At the 9th Edition of TiE Global Summit 2024 in Bengaluru, STPI co-hosted the event with international giants Intel, Bosch, Schinder Electric, and GIEEE.

The Society for Technical Professionals in India (STPI) co-hosted the 9th edition of the TiE Global Summit 2024 in Bengaluru. The event brought together industry leaders, entrepreneurs, and innovators to discuss the latest trends and technologies. During the summit, STPI exchanged Memorandums of Understanding (MoUs) with four prominent organizations: Intel, Bosch, Schinder Electric, and GIEEE CXOToday.com. These partnerships aim to foster collaboration, knowledge sharing, and innovation in the fields of technology and entrepreneurship. The MoUs will facilitate joint research, development, and implementation of cutting-edge technologies, as well as provide a platform for startups and small businesses to access resources, expertise, and funding. The partnership with Intel, for instance, will focus on 5G and AI-enabled technologies, while the partnership with Bosch will concentrate on Industry 4.0 and IoT solutions. The agreements are expected to drive growth, create jobs, and contribute to the country’s economic development.