HCL Technologies (HCLTech) has been selected as a Design Solution Partner (DSP) under Samsung’s Advanced Foundry Ecosystem (SAFE) program, a significant milestone for both companies. This partnership aims to accelerate semiconductor innovation and development by leveraging HCLTech’s expertise in engineering and R&D services. As part of this partnership, HCLTech will offer comprehensive ASIC design services to Samsung’s semiconductor customers, allowing them to use Samsung’s process technologies.
As a DSP, HCLTech will have access to Samsung’s advanced technology stack, training its employees on cutting-edge technologies and offering technical support on turnkey projects. Additionally, Samsung will provide HCLTech with enhanced wafer access through Multi-Project Wafer (MPW) programs, facilitating efficient prototyping and production. This collaboration will enable both companies to accelerate time-to-market for new silicon technologies.
Taejoong Song, Vice President and head of the Technology Planning 2 Team at Samsung Electronics, underscored the significance of this partnership, stating that it highlights a shared commitment to innovation and excellence. Sanjay Gupta, Corporate Vice President of North Asia at HCLTech, emphasized that this partnership demonstrates HCLTech’s dedication to innovation and developing state-of-the-art custom silicon solutions.
The semiconductor industry is growing rapidly, and this partnership between HCLTech and Samsung Foundry is a testament to their willingness to collaborate and push the boundaries of what is possible. By combining their expertise, they will create new opportunities for innovation and growth, ultimately driving advancements in the field of semiconductors. With this partnership, HCLTech is set to play a crucial role in accelerating semiconductor innovation and development, solidifying its position as a leading player in the industry.