Siemens and nVent have collaborated to create a joint reference architecture for liquid cooling and power infrastructure in large-scale NVIDIA-based artificial intelligence (AI) data centers. The blueprint is designed for hyperscale facilities of up to 100 MW that run intensive AI workloads, combining Siemens’ electrical and automation systems with nVent’s liquid cooling technology and NVIDIA’s DGX SuperPOD reference designs. The architecture targets operators building or expanding AI clusters using systems such as NVIDIA DGX SuperPOD with DGX GB200, supporting Tier III-capable configurations and using a modular approach for rapid deployment across multiple sites.
The reference architecture focuses on the rising power density of AI racks and the shift towards direct liquid cooling for graphics processing units and other accelerators. Siemens will supply industrial electrical systems and control technologies, while nVent will contribute its liquid cooling solutions for server and rack-level heat management. The companies aim to improve deployment speed and energy efficiency, with “tokens-per-watt” as a core metric, defining AI output per unit of energy consumed.
The design emphasizes modular and fault-tolerant configurations that can be repeated across multiple data halls and locations, aligning with the roll-out strategies of hyperscale cloud and AI providers. The collaboration also creates a structured path for future product updates as chip thermal design power and rack densities rise. The partners expect AI data center designs to evolve further as workloads spread across more locations and as regulatory attention on energy use intensifies.
Siemens has expanded its presence in the data center market, applying automation, power distribution, and building technologies from its industrial and infrastructure portfolios into mission-critical facilities. The company positions its Intelligent Infrastructure business as a bridge between energy networks, buildings, and industrial sites, with data centers as key digital infrastructure assets. nVent has built its liquid cooling business around direct engagement with chip manufacturers and original equipment makers, with a portfolio spanning cooling for servers, networking gear, and power electronics.
The joint reference architecture is expected to accelerate time-to-compute and maximize tokens-per-watt, providing a blueprint for scale that is modular, fault-tolerant, and energy-efficient. The collaboration between Siemens, nVent, and NVIDIA aims to drive innovation, interoperability, and sustainability, helping operators build future-ready data centers that unlock AI’s full potential. As the demand for AI computing continues to grow, the partnership is well-positioned to support the development of efficient and scalable data center infrastructure.